Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875987 | Systems and methods for marking plastics | — | 2020-12-29 |
| 10727267 | Interconnect bump structures for photo detectors | Wei Zhang, Michael John Evans, Wei Huang, Paul L. Bereznycky, Namwoong Paik | 2020-07-28 |