Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727267 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Wei Huang, Namwoong Paik | 2020-07-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727267 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Wei Huang, Namwoong Paik | 2020-07-28 |