Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879204 | Bump structures for high density flip chip interconnection | Wei Zhang, Wei Huang, Namwoong Paik | 2020-12-29 |
| 10622324 | Bump structures for high density flip chip interconnection | Wei Zhang, Wei Huang, Namwoong Paik | 2020-04-14 |
| 10539464 | Imaging systems and methods | John Liobe | 2020-01-21 |