Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811376 | Cu column, Cu core column, solder joint, and through-silicon via | Hiroyoshi Kawasaki, Takahiro Roppongi, Isamu Sato, Yuji Kawamata | 2020-10-20 |
| 10717157 | Solder material, solder paste, solder preform, solder joint and method of managing the solder material | Takahiro Hattori, Hiroyoshi Kawasaki, Hiroshi Okada, Takahiro Roppongi, Isamu Sato | 2020-07-21 |
| 10675719 | Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Takashi Hagiwara +3 more | 2020-06-09 |
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima +1 more | 2020-05-05 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori +4 more | 2020-04-07 |