Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10773345 | Solder alloy, solder ball, chip solder, solder paste, and solder joint | Ken Tachibana | 2020-09-15 |
| 10717157 | Solder material, solder paste, solder preform, solder joint and method of managing the solder material | Hiroyoshi Kawasaki, Hiroshi Okada, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2020-07-21 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Roppongi +4 more | 2020-04-07 |