Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2020-05-05 |
| 10610979 | Flux composition for solder applications | Daisuke Maruko, Atsumi Takahashi, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi +4 more | 2020-04-07 |