Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2020-05-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10639749 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2020-05-05 |