Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741518 | Method of fabricating semiconductor package | Seokhyun Lee, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2020-08-11 |
| 10622320 | Semiconductor package and method of manufacturing the same | Jong Youn Kim, Seok Hyun LEE, Kyoung Lim Suk, Seok-Won Lee | 2020-04-14 |
| 10546829 | Method of fabricating semiconductor package | Seokhyun Lee, Jongyoun Kim, Kyoung Lim Suk, Seokwon Lee | 2020-01-28 |