Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879163 | Fan-out semiconductor package having redistribution line structure | Jong Youn Kim | 2020-12-29 |
| 10847468 | Semiconductor package including interposer | Jong Youn Kim | 2020-11-24 |
| 10622320 | Semiconductor package and method of manufacturing the same | Jong Youn Kim, Youn-ji Min, Kyoung Lim Suk, Seok-Won Lee | 2020-04-14 |