Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879187 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Seokhyun Lee | 2020-12-29 |
| 10879292 | Semiconductor package and method of manufacturing the same | Jaegwon Jang, Seokhyun Lee | 2020-12-29 |
| 10741518 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Jongyoun Kim, Seokwon Lee | 2020-08-11 |
| 10622320 | Semiconductor package and method of manufacturing the same | Jong Youn Kim, Seok Hyun LEE, Youn-ji Min, Seok-Won Lee | 2020-04-14 |
| 10546829 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Jongyoun Kim, Seokwon Lee | 2020-01-28 |