Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833002 | Connection structure and method of forming the same | — | 2020-11-10 |
| 10741518 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Kyoung Lim Suk, Seokwon Lee | 2020-08-11 |
| 10685890 | Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same | Seokhyun Lee | 2020-06-16 |
| 10546829 | Method of fabricating semiconductor package | Youn-ji Min, Seokhyun Lee, Kyoung Lim Suk, Seokwon Lee | 2020-01-28 |