Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868073 | Method of fabricating semiconductor package | Yungcheol Kong, Hyunsu Jun, Kyoungsei Choi | 2020-12-15 |
| 10818603 | Semiconductor package having redistribution layer | Young Kun Jee, II Hwan Kim | 2020-10-27 |
| 10804212 | Semiconductor device and package including modified region of less density at edge of device or substrate | Yeong Kwon Ko, Jun Yeong Heo, Ja-Yeon Lee | 2020-10-13 |
| 10756055 | Stacked image sensor package and stacked image sensor module including the same | Yungcheol Kong, Kyoungsei Choi | 2020-08-25 |
| 10685921 | Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same | Young Kun Jee, Ji Hwang Kim | 2020-06-16 |
| 10535534 | Method of fabricating an interposer | Tae-Je Cho, Hyuek Jae Lee, Cha-Jea Jo | 2020-01-14 |