Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868073 | Method of fabricating semiconductor package | Un-Byoung Kang, Yungcheol Kong, Hyunsu Jun | 2020-12-15 |
| 10825776 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Heeseok Lee | 2020-11-03 |
| 10756055 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Yungcheol Kong | 2020-08-25 |