Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868073 | Method of fabricating semiconductor package | Un-Byoung Kang, Hyunsu Jun, Kyoungsei Choi | 2020-12-15 |
| 10756055 | Stacked image sensor package and stacked image sensor module including the same | Un-Byoung Kang, Kyoungsei Choi | 2020-08-25 |