Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818603 | Semiconductor package having redistribution layer | II Hwan Kim, Un-Byoung Kang | 2020-10-27 |
| 10685921 | Semiconductor chip module including a channel for controlling warpage and method of manufacturing the same | Ji Hwang Kim, Un-Byoung Kang | 2020-06-16 |