Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840200 | Manufacturing method of chip package structure comprising encapsulant having concave surface | Hung-Hsin Hsu, Nan-Chun Lin, Shang-Yu Chang Chien | 2020-11-17 |
| 10607860 | Package structure and chip structure | Chia-Wei Chiang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2020-03-31 |
| 10593629 | Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof | Chia-Wei Chiang, Wen-Jeng Fan | 2020-03-17 |