Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840200 | Manufacturing method of chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Hung-Hsin Hsu, Nan-Chun Lin | 2020-11-17 |
| 10796931 | Manufacturing method of package structure | Han-Wen Lin, Hung-Hsin Hsu, Nan-Chun Lin | 2020-10-06 |
| 10756065 | Method thereof of package structure | Hung-Hsin Hsu, Nan-Chun Lin | 2020-08-25 |
| 10629559 | Semiconductor package and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2020-04-21 |
| 10593647 | Package structure and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2020-03-17 |