Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10862202 | Integrated antenna package structure and manufacturing method thereof | Yun-Hsin Yeh | 2020-12-08 |
| 10840200 | Manufacturing method of chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Nan-Chun Lin, Shang-Yu Chang Chien | 2020-11-17 |
| 10796931 | Manufacturing method of package structure | Han-Wen Lin, Shang-Yu Chang Chien, Nan-Chun Lin | 2020-10-06 |
| 10788205 | Atomizing system | — | 2020-09-29 |
| 10756065 | Method thereof of package structure | Shang-Yu Chang Chien, Nan-Chun Lin | 2020-08-25 |
| 10629559 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2020-04-21 |
| 10629554 | Package structure and manufacturing method thereof | Nan-Chun Lin | 2020-04-21 |
| 10593647 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2020-03-17 |