Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607860 | Package structure and chip structure | Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin | 2020-03-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607860 | Package structure and chip structure | Chia-Wei Chiang, Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin | 2020-03-31 |