Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777453 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Michal Danek, Chiukin Steven Lai, Joshua Collins, Hanna Bamnolker +3 more | 2020-09-15 |
| 10731250 | Depositing ruthenium layers in interconnect metallization | Do-Young Kim, Jeong-Seok Na, Chiukin Steven Lai, Michal Danek | 2020-08-04 |
| 10580654 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Michal Danek | 2020-03-03 |
| 10580695 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2020-03-03 |
| 10546751 | Forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba +2 more | 2020-01-28 |
| 10529722 | Tungsten for wordline applications | Michal Danek, Hanna Bamnolker, Juwen Gao | 2020-01-07 |