Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10731250 | Depositing ruthenium layers in interconnect metallization | Do-Young Kim, Chiukin Steven Lai, Raashina Humayun, Michal Danek | 2020-08-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10731250 | Depositing ruthenium layers in interconnect metallization | Do-Young Kim, Chiukin Steven Lai, Raashina Humayun, Michal Danek | 2020-08-04 |