Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777453 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Raashina Humayun, Chiukin Steven Lai, Joshua Collins, Hanna Bamnolker +3 more | 2020-09-15 |
| 10731250 | Depositing ruthenium layers in interconnect metallization | Do-Young Kim, Jeong-Seok Na, Chiukin Steven Lai, Raashina Humayun | 2020-08-04 |
| 10580654 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Raashina Humayun | 2020-03-03 |
| 10580695 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2020-03-03 |
| 10573522 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Siew Neo +2 more | 2020-02-25 |
| 10546751 | Forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba +2 more | 2020-01-28 |
| 10529722 | Tungsten for wordline applications | Hanna Bamnolker, Raashina Humayun, Juwen Gao | 2020-01-07 |