Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844457 | Ferritic stainless steel foil | Hiroto Unno, Naoya SAWAKI, Naoki Fujimoto, Masahiro Fukuda, Toru Inaguma | 2020-11-24 |
| 10840208 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Daizo Oda, Takashi Yamada | 2020-11-17 |
| 10786974 | Stainless steel foil | Hiroto Unno, Naoya SAWAKI, Naoki Fujimoto, Masahiro Fukuda, Toru Inaguma | 2020-09-29 |
| 10790259 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Takashi Yamada, Daizo Oda | 2020-09-29 |
| 10789228 | Data presence/absence determination apparatus and computer-readable storage medium storing program for determination of data presence/absence | Takuya Nagao, Takashi Kuwayama, Tomonori Furuta | 2020-09-29 |
| 10771011 | Circuit device, oscillator, electronic apparatus, and vehicle | — | 2020-09-08 |
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2020-08-11 |
| 10672733 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara | 2020-06-02 |
| 10615123 | Three-dimensional memory device containing compositionally graded word line diffusion barrier layer for and methods of forming the same | Tatsuya Hinoue, Tomoyuki Obu, Yusuke Mukae, Rahul Sharangpani, Raghuveer S. Makala +2 more | 2020-04-07 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Ryo OISHI, Kazuyuki Saito | 2020-04-07 |
| 10529683 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Daizo Oda, Takashi Yamada | 2020-01-07 |