Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-08-11 |
| 10672733 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2020-06-02 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-04-07 |