Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840208 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2020-11-17 |
| 10790259 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2020-09-29 |
| 10737356 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-08-11 |
| 10672733 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2020-06-02 |
| 10610976 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2020-04-07 |
| 10529683 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2020-01-07 |