Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840208 | Bonding wire for semiconductor device | Tomohiro Uno, Daizo Oda, Takashi Yamada | 2020-11-17 |
| 10790259 | Cu alloy bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2020-09-29 |
| 10529683 | Bonding wire for semiconductor device | Tomohiro Uno, Daizo Oda, Takashi Yamada | 2020-01-07 |