Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741521 | Semiconductor package and method of manufacturing semiconductor package | Jin Won Jeong, Do-Young Kim, Hye Ji Lee, Byeung Soo SONG | 2020-08-11 |
| 10705116 | Test socket of flexible semiconductor chip package and bending test method using the same | Jin Won Jeong, Young-sug Seong, Dong Keun Lee | 2020-07-07 |
| 10669517 | Apparatus for accelerating reproduction of odor from air-conditioner and method for the same | Tae Hee Lee, Ki Young YOON, Ji Wan Kim, So Yoon Park | 2020-06-02 |
| 10644121 | Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon | Myung Ho Park, Ul Kyu SEO, Young Ho Seo | 2020-05-05 |