Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741521 | Semiconductor package and method of manufacturing semiconductor package | Jae Sik Choi, Do-Young Kim, Hye Ji Lee, Byeung Soo SONG | 2020-08-11 |
| 10705116 | Test socket of flexible semiconductor chip package and bending test method using the same | Jae Sik Choi, Young-sug Seong, Dong Keun Lee | 2020-07-07 |