Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10705116 | Test socket of flexible semiconductor chip package and bending test method using the same | Jae Sik Choi, Jin Won Jeong, Dong Keun Lee | 2020-07-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10705116 | Test socket of flexible semiconductor chip package and bending test method using the same | Jae Sik Choi, Jin Won Jeong, Dong Keun Lee | 2020-07-07 |