Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10644121 | Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon | Ul Kyu SEO, Young Ho Seo, Jae Sik Choi | 2020-05-05 |
| 10573571 | Wafer-level chip-scale package including power semiconductor and manufacturing method thereof | Beom Su Kim, Sun Hwan Kim | 2020-02-25 |