Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10790094 | Method of forming a leadless stack comprising multiple components | Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller | 2020-09-29 | |
| 10757810 | High density multi-component packages | John Bultitude, Galen W. Miller | 2020-08-25 | |
| 10729051 | Component stability structure | John Bultitude | 2020-07-28 | |
| 10707145 | High density multi-component packages | John Bultitude, Galen W. Miller | 2020-07-07 | |
| 10681814 | High density multi-component packages | John Bultitude, Galen W. Miller | 2020-06-09 | $14,817,000 |