Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790094 | Method of forming a leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill | 2020-09-29 |
| 10757810 | High density multi-component packages | John Bultitude, John E. McConnell | 2020-08-25 |
| 10757811 | Higher density multi-component and serial packages | James A. Burk, John Bultitude | 2020-08-25 |
| 10707145 | High density multi-component packages | John Bultitude, John E. McConnell | 2020-07-07 |
| 10681814 | High density multi-component packages | John Bultitude, John E. McConnell | 2020-06-09 |