Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840023 | Multilayered ceramic capacitor structures for use at high power | Philip M. Lessner, Abhijit Gurav | 2020-11-17 |
| 10790094 | Method of forming a leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, R. Allen Hill, Galen W. Miller | 2020-09-29 |
| 10757810 | High density multi-component packages | Galen W. Miller, John E. McConnell | 2020-08-25 |
| 10757811 | Higher density multi-component and serial packages | James A. Burk, Galen W. Miller | 2020-08-25 |
| 10729051 | Component stability structure | John E. McConnell | 2020-07-28 |
| 10707145 | High density multi-component packages | Galen W. Miller, John E. McConnell | 2020-07-07 |
| 10681814 | High density multi-component packages | Galen W. Miller, John E. McConnell | 2020-06-09 |
| 10622157 | Multilayer ceramic structure | — | 2020-04-14 |
| 10593483 | Multilayer ceramic structure | — | 2020-03-17 |