Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672713 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2020-06-02 |
| 10658198 | Solder resist layer structures for terminating de-featured components and methods of making the same | Li-Sheng Weng, Chi-Te Chen, Olivia Chen, Yun Ling | 2020-05-19 |
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Yi Li | 2020-04-21 |
| 10624213 | Asymmetric electronic substrate and method of manufacture | Sri Chaitra Jyotsna Chavali, Amruthavalli Pallavi Alur, Sriram Srinivasan | 2020-04-14 |