Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658198 | Solder resist layer structures for terminating de-featured components and methods of making the same | Chi-Te Chen, Wei-Lun Kane Jen, Olivia Chen, Yun Ling | 2020-05-19 |