Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840219 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2020-11-17 |
| 10770369 | Semiconductor device package | Chih-Pin Hung, Jin-Feng Yang, Meng-Kai SHIH | 2020-09-08 |
| 10586716 | Semiconductor device package | Ying-Xu Lu, Jin-Yuan Lai, Tse-Chuan Chou, Meng-Kai SHIH, Shin-Luh TARNG | 2020-03-10 |