Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833051 | Precision alignment of multi-chip high density interconnects | Charles L. Arvin, Thomas Weiss, Thomas A. Wassick | 2020-11-10 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |