Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770387 | Integrated circuit package substrate | Qinglei Zhang | 2020-09-08 |
| 10763216 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Johanna M. Swan +1 more | 2020-09-01 |
| 10672713 | High density organic bridge device and method | Mihir K. Roy, Wei-Lun Kane Jen | 2020-06-02 |