SK

Seth L. Knupp

IBM: 1 patents #5,490 of 11,274Top 50%
📍 Schenectady, NY: #61 of 134 inventorsTop 50%
🗺 New York: #4,995 of 13,306 inventorsTop 40%
Overall (2020): #281,036 of 565,922Top 50%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10643890 Ultrathin multilayer metal alloy liner for nano Cu interconnects Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Vamsi K. Paruchuri +2 more 2020-05-05