Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784224 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Owen R. Fay | 2020-09-22 |
| 10770435 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2020-09-08 |
| 10748878 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2020-08-18 |
| 10580746 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2020-03-03 |
| 10573612 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, James M. Derderian, Jian Li | 2020-02-25 |
| 10559551 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2020-02-11 |
| 10541229 | Apparatuses and methods for semiconductor die heat dissipation | Xiao Li, Anilkumar Chandolu | 2020-01-21 |
| 10541355 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2020-01-21 |