Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875153 | Advanced polishing pad materials and formulations | Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Ashwin CHOCKALINGAM | 2020-12-29 |
| 10875145 | Polishing pads produced by an additive manufacturing process | Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna, Jason Garcheung Fung +12 more | 2020-12-29 |
| 10843306 | Printing a chemical mechanical polishing pad | Barry Chin, Terrance Y. Lee | 2020-11-24 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna, Jason Garcheung Fung +12 more | 2020-11-03 |
| 10800000 | Multi-layered nano-fibrous CMP pads | Robert D. Tolles, Mahendra C. ORILALL, Fred C. Redeker | 2020-10-13 |
| 10773509 | Pad structure and fabrication methods | Hou T. Ng, Nag B. Patibandla, Daniel Redfield, Ashwin CHOCKALINGAM, Mayu YAMAMURA +1 more | 2020-09-15 |
| 10618141 | Apparatus for forming a polishing article that has a desired zeta potential | Ashwin CHOCKALINGAM, Mahendra C. ORILALL, Mayu YAMAMURA, Boyi Fu, Daniel Redfield | 2020-04-14 |
| 10593574 | Techniques for combining CMP process tracking data with 3D printed CMP consumables | Jason Garcheung Fung, Daniel Redfield, Aniruddh Jagdish Khanna, Mario CORNEJO, Gregory E. Menk +1 more | 2020-03-17 |
| 10537973 | Correction of fabricated shapes in additive manufacturing | Mayu YAMAMURA, Jason Garcheung Fung, Daniel Redfield, Hou T. Ng | 2020-01-21 |
| 10537974 | CMP pad construction with composite material properties using additive manufacturing processes | Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla +4 more | 2020-01-21 |