Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Timothy A. Gosselin, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Shawna M. Liff, Henning Braunisch, Timothy A. Gosselin, Yikang Deng, Zhiguo Qian | 2020-11-24 |