Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840214 | Carrier and integrated memory | Charles L. Arvin, Brian M. Erwin, Brian W. Quinlan, Charles L. Reynolds, Thomas Weiss | 2020-11-17 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |