Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854629 | Three-dimensional memory device containing asymmetric, different size support pillars and method for making the same | Chun Ge, Fabo Yu, Xin Li, Yanli Zhang | 2020-12-01 |
| 10825826 | Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same | Tae Kyung Kim, Johann Alsmeier, Yan Li, Jian Chen | 2020-11-03 |
| 10804197 | Memory die containing stress reducing backside contact via structures and method of making the same | Motoki KAWASAKI, Arata Okuyama, Xun Gu, Kengo Kajiwara | 2020-10-13 |
| 10707228 | Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same | Tae Kyung Kim, Johann Alsmeier, Yan Li, Jian Chen | 2020-07-07 |
| 10672657 | Semiconductor device structures including stair step structures, and related semiconductor devices | Matthew Park, Adam L. Olson | 2020-06-02 |
| 10658381 | Memory die having wafer warpage reduction through stress balancing employing rotated three-dimensional memory arrays and method of making the same | Fumiaki Toyama, Masaaki Higashitani, Tong Zhang, Chun Ge, Xin Li +1 more | 2020-05-19 |