Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854513 | Cavity-disrupting backside trench fill structures for a three-dimensional memory device and method of making the same | Toshiyuki Sega | 2020-12-01 |
| 10804197 | Memory die containing stress reducing backside contact via structures and method of making the same | Arata Okuyama, Xun Gu, Kengo Kajiwara, Jixin Yu | 2020-10-13 |