Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet +5 more | 2020-08-18 |
| 10679887 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-06-09 |
| 10658182 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2020-05-19 |
| 10651134 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker | 2020-05-12 |
| 10651036 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Li-Wen Hung, John U. Knickerbocker | 2020-05-12 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Gerard McVicker +4 more | 2020-03-31 |
| 10586726 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-03-10 |
| 10573538 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2020-02-25 |