Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833049 | Method for electrical coupling and electric coupling arrangement | Richard D. Dixon, Maaike M. Visser Taklo, Bernhard Wunderle, Kerry Yu, Jonas Zuercher | 2020-11-10 |
| 10777496 | Chip packages with sintered interconnects formed out of pads | Luca Del Carro, Jonas Zürcher | 2020-09-15 |
| 10767939 | Disconnect assembly for active cooling of packaged electronics | Gerd Schlottig, Stephan Paredes, Ingmar G. Meijer | 2020-09-08 |
| 10727159 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-07-28 |
| 10727158 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-07-28 |
| 10622296 | Circuitized substrate with electronic components mounted on transversal portion thereof | Sebastian Gerke, Stefano S. Oggioni | 2020-04-14 |
| 10622294 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2020-04-14 |
| 10622295 | Circuitized substrate with electronic components mounted on transversal portion thereof | Sebastian Gerke, Stefano S. Oggioni | 2020-04-14 |
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Timothy J. Chainer, Evan G. Colgan, Michael A. Gaynes, Jeffrey D. Gelorme, Gerard McVicker +4 more | 2020-03-31 |
| 10586760 | Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly | Kerry Bernstein, Bruno Michel | 2020-03-10 |
| 10527365 | Disconnect assembly for active cooling of packaged electronics | Gerd Schlottig, Stephan Paredes, Ingmar G. Meijer | 2020-01-07 |
| 10529648 | Counter-flow expanding channels for enhanced two-phase heat removal | Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida +3 more | 2020-01-07 |