Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10767939 | Disconnect assembly for active cooling of packaged electronics | Stephan Paredes, Ingmar G. Meijer, Thomas J. Brunschwiler | 2020-09-08 |
| 10763189 | Sealing arrangement | Ingmar G. Meijer, Stefano S. Oggioni, Stephan Paredes | 2020-09-01 |
| 10727158 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-07-28 |
| 10727159 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-07-28 |
| 10551132 | Heat removal element with thermal expansion coefficient mismatch | Gerhard Ingmar Meijer | 2020-02-04 |
| 10529648 | Counter-flow expanding channels for enhanced two-phase heat removal | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong +3 more | 2020-01-07 |
| 10527365 | Disconnect assembly for active cooling of packaged electronics | Stephan Paredes, Ingmar G. Meijer, Thomas J. Brunschwiler | 2020-01-07 |