Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843380 | Method for the material-saving production of wafers and processing of wafers | Wolfram Drescher, Jan Richter | 2020-11-24 |
| 10676386 | Method for guiding a crack in the peripheral region of a donor substrate | Marko Swoboda, Christian Beyer, Jan Richter | 2020-06-09 |