| 10767084 |
Enhanced adhesive materials and processes for 3D applications |
James L. Hedrick, Robert D. Miller, Sampath Purushothaman, Mary E. Rothwell, Willi Volksen +1 more |
2020-09-08 |
| 10727114 |
Interconnect structure including airgaps and substractively etched metal lines |
Robert L. Bruce, Alfred Grill, Eric A. Joseph, Teddie Peregrino Magbitang, Hiroyuki Miyazoe |
2020-07-28 |
| 10684246 |
On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling |
Hariklia Deligianni, Bruce B. Doris, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin +2 more |
2020-06-16 |
| 10685323 |
Blockchain ledgers of material spectral signatures for supply chain integrity management |
Nicholas C. M. Fuller, Prabhakar Kudva |
2020-06-16 |
| 10585060 |
On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling |
Hariklia Deligianni, Bruce B. Doris, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin +2 more |
2020-03-10 |
| 10541151 |
Disposable laser/flash anneal absorber for embedded neuromorphic memory device fabrication |
Kam-Leung Lee, Son V. Nguyen, Martin M. Frank, Vijay Narayanan |
2020-01-21 |
